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种子名称：
[ TutGee.com ] Udemy - Advanced Materials For Electronics Packaging
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视频
文件数目：
31个文件
文件大小：
403.01 MB
收录时间：
2022-2-1 14:57
已经下载：
3次
资源热度：
262
最近下载：
2024-12-26 10:09
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[ TutGee.com ] Udemy - Advanced Materials For Electronics Packaging.torrent
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.mp46.15MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.mp47.28MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp420.92MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .mp412.62MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp410.52MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.mp419.25MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp411.38MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.mp48.91MB
~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp46.44MB
~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp414.26MB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp437.44MB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp419.28MB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.mp421.28MB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.mp49.31MB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp419.9MB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.mp45.58MB
~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.mp417.07MB
~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp414.68MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.mp411.95MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.mp411.77MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.mp411.09MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.mp45.7MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.mp49.66MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.mp49.21MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).mp414.27MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.mp414.86MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).mp417.71MB
~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.mp46.11MB
~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp49.63MB
~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.mp414.2MB
~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.mp44.56MB
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